Flexible Electronics News

Infineon Reaches Next Milestone on 200 mm SiC Roadmap

Infineon releases first silicon carbide products to customers based on advanced 200 mm SiC wafer manufacturing technology.

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By: DAVID SAVASTANO

Editor, Ink World Magazine

Infineon Technologies AG has made significant progress on its 200 mm silicon carbide (SiC) roadmap. The company will already release the first products based on the advanced 200 mm SiC technology to customers in Q1 2025. The products, manufactured in Villach, Austria, provide first-class SiC power technology for high-voltage applications, including renewable energies, trains, and electric vehicles. Additionally, the transition of Infineon’s manufacturing site in Kulim, Malaysia, from 15...

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